新材料科技與化學(xué)技術(shù)創(chuàng)新
電鍍中間體/水性工業(yè)涂料/工業(yè)清洗化學(xué)品
Microfill? LVF 3 Acid Copper from Dupont Dow Rhom Hass Company
2022-03-07 10:06
Microfill™ LVF 3 Acid Copper is designed to offer exceptional blind microvia filling performance, and is specifically formulated for use with insoluble anodes and direct current (DC) rectification. Formulated to operate over a broad range of operating conditions, the bath offers end users with outstanding production flexibility in either panel or pattern plate operation.
Advantages:
- Excellent blind microvia fill with lower copper surface thickness
- Bright, highly ductile, leveled deposit
- DC process with insoluble anodes for simple operation
- Easily analyzed and controlled by conventional CVS
- Designed for use in both pattern and panel plate applications
- Tunable process for specific end user requirements
Download Presentation English only
Read Technical Article English only
Read Technology for Through Hole Filling
Microfill™ THF Electrolytic Copper
Dielectric thickness: 110 µm
Plating thickness: 12 µm
酸性鍍銅中間體相關(guān)鏈接：
垂直連續(xù)電鍍（VCP）高TP值酸性鍍銅光澤劑用電鍍中間體：m.xjren.com.cn/news/170.html
PCB/FPC用高TP值VCP酸性鍍銅光亮劑中間體產(chǎn)品介紹：m.xjren.com.cn/news/30.html
2021年度填孔鍍銅——印刷線路板（PCB，F(xiàn)PC）酸性填孔鍍銅中間體：m.xjren.com.cn/news/283.html
2021年國(guó)際表面處理展電子展廳：
深圳市同泰化學(xué)技術(shù)有限公司參加了2021年7月26-28日在廣州保利世貿(mào)博覽館舉辦的第十四屆廣州國(guó)際表面處理、電鍍、涂裝展覽會(huì)，誠(chéng)邀您蒞臨同泰化學(xué)電子展廳參觀指導(dǎo)！電子展廳鏈接：m.xjren.com.cn/news/316.html。
下一篇
微信掃一掃，關(guān)注我們